Technological advancements are now considered necessities as the role of microelectronics in the Aerospace & Defense sector has become increasingly significant...
Technological advancements are now considered necessities as the role of microelectronics in the Aerospace & Defense sector has become increasingly significant. Microelectronics, the study and manufacture of tiny electronic devices and circuits, has revolutionized this field by offering sophisticated, compact, and highly efficient components. These parts are at the heart of innovations that enable deep space exploration, enhance national security, and push the boundaries of aerospace engineering. The miniaturization of electronic components allows for the construction of more agile and fuel-efficient spacecraft, advanced surveillance and communication satellites, and cutting-edge defense systems. The reliability of these microelectronic devices is critical as the environment they are used in is often harsh and unforgiving, with little margin for error.
At TTM Technologies (“TTM”), we understand the unique challenges of integrating microelectronics into aerospace and defense applications, and our team of experts is ready to launch your next project with you. TTM offers design-to-specification and build-to-print solutions that adapt to changes in each mission with unmatched reliability and performance. Our global network of engineers is here to support your next project and provide you with the knowledge you need to engage with your PCB and electronic component suppliers at a deeper level. We have three TTM Tech Academywebinars covering i) PCB Design for Manufacturing: Cost Considerations, ii) Impedance Control and Stack-ups Fundamentals, and iii) Rigid-Flex Applications; register today at the below links.
Yours sincerely,
TTM Corporate Marketing
Monthly Highlights
Beam Signing Ceremony at the new Syracuse, New York Manufacturing Location
We celebrated our state-of-the-art greenfield facility with a beam signing ceremony at the new Syracuse, New York manufacturing location.
TTM executives, state and local officials, leading Defense customers, and TTM employees were present at the milestone event. This new facility will allow TTM to significantly increase domestic capacity for ultra-high density interconnect PCBs and create a resilient domestic supply chain for this critical technology and manufacturing capability.
Pictured left to right: Catherine Gridley, Executive Vice President and President Aerospace & Defense Sector of TTM Technologies, New York Governor Kathy Hochul, and Thomas Edman, President and CEO of TTM Technologies
TTM has been named Cisco’s 2024 Supply Chain Security Champion!
During Cisco’s annual Supplier Appreciation Event, TTM was recognized for its commitment to security excellence, protecting both Cisco IP and brand through its robust security operations.
December 4-6, 2024 | Shenzhen World Exhibition & Convention Center (Bao’an), China
HKPCA Show 2024
SAVE THE DATE! Join us Dec 4-6, 2024, for HKPCA 2024, one of the largest international exhibitions in the PCB and electronic assembly industry. This event is filled with inspiration, networking, and opportunities to expand your horizons. Check out our highlights from last year to give you a glimpse of what you can expect from the event: https://ow.ly/1r2S50TGnq5
Event: International Electronics Circuit Exhibition (Shenzhen) Date: Dec 4-6, 2024 Location: Shenzhen World Exhibition & Convention Center (Bao’an), China Booth Number: 7D20, Hall 7
Live Webinar
PCB Design for Manufacturing: Cost Considerations
Session 1 (for AP time zone):
📅 Date: Tuesday, November 5, 2024 🕒 Time: [HKT] 10:00 AM 🗣️ Language: Mandarin
Session 2 (for NA and EU time zones):
📅 Date: Tuesday, November 5, 2024 🕒 Time: [PT] 08:00 AM | [EST] 11:00 AM | [CET] 5:00 PM 🗣️ Language: English
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting increased investments.
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. This growth is primarily driven by advanced packaging for FC-CSP and baseband applications, as well as demand from 5G wireless devices, HPC, GPUs, servers, and the automotive industry—all major users of FC-BGA substrates.
The automotive supply chain has been divided into two camps in recent years: the West, encompassing Europe and the US, and China. While near-term demand projections remain uncertain, IC distributors maintain optimism about global automotive demand in 2025.
Recent collaborations and initiatives in the industry showcase how AI is being integrated into both clinical and administrative processes. From enhancing bedside care to simplifying documentation workflows, AI is having a significant impact on various aspects of healthcare delivery.
The North American robotics market saw a decline in both units ordered (down 7.9% to 15,705 units) and revenue (down 6.8% to $982.83 million) during the first half of 2024 compared to the same period in 2023.
Major US-based CSPs have estimated their 2024 capex will increase by at least 35% YoY, with research firms expecting the amounts to rise further in 2025 as the CSPs continue expanding new ASIC projects in the wake of the AI boom.
Sales of GPUs and accelerators reached a record $54 billion in 2Q 2024. This growth was driven largely by high demand for GPUs and custom accelerators in the hyperscale cloud market.
Spending on Ethernet data center switches rebounded in 2Q 2024, after a temporary decline in the first quarter. A soaring increase in AI-related investments offset ongoing softness in traditional networks used for general-purpose servers.
2Q 2024 worldwide Ethernet Campus Switch revenues contracted year-over-year for the third quarter in a row. Ethernet campus switch sales hit an all-time high in 2Q 2023 and a year later, vendors are suffering in comparison.
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